coreless substrate technology
coreless substrate technology

由BHsu著作·2010·被引用4次—Abstract:Therationalofusingthecorelesstechnologytobuildpackagingsubstratesversustheconventionalcoreapproachisfirstdescribed.,由BKAppelt著作·2010·被引用5次—Theconceptofcorelessorganicsubstratesisinspiredbymulti-layerceram...

Access

ACCESSisaworldleaderinadvancedorganiccorelesssubstratetechnology.Recognizedasaninternationalpioneerinthesemiconductorindustry, ...

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A coreless technology overview for packaging substrates

由 B Hsu 著作 · 2010 · 被引用 4 次 — Abstract: The rational of using the coreless technology to build packaging substrates versus the conventional core approach is first described.

A New Coreless Substrate Technology

由 BK Appelt 著作 · 2010 · 被引用 5 次 — The concept of coreless organic substrates is inspired by multi-layer ceramic substrate. The ceramic technology uses metal filled vias to interconnect adjacent ...

A New Coreless Substrate Technology

Based on the stacked shell elements, a new technique is used to study the laminated thin plate with arbitrary number and oriented plies. The stacked shells are ...

Access

ACCESS is a world leader in advanced organic coreless substrate technology. Recognized as an international pioneer in the semiconductor industry, ...

Coreless Package Substrate Issues and Challenges

Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter, smaller and superior electrical performance regarding ...

Coreless substrate technology investigation for ultra

由 M Manusharow 著作 · 2012 · 被引用 12 次 — This paper reviews the design strategies implemented and characterization data collected to achieve matched electrical performance with the existing cored ...

Plastic BGA Thin Substrate (Coreless Substrate)

SHINKO supplies coreless substrates which are thin build-up substrates made by removing a core layer for memory or others use in sophisticated small electronic ...

Warpage Issues and Assembly Challenges Using Coreless ...

由 J Kim 著作 · 被引用 33 次 — Abstract. Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter, smaller and.


corelesssubstratetechnology

由BHsu著作·2010·被引用4次—Abstract:Therationalofusingthecorelesstechnologytobuildpackagingsubstratesversustheconventionalcoreapproachisfirstdescribed.,由BKAppelt著作·2010·被引用5次—Theconceptofcorelessorganicsubstratesisinspiredbymulti-layerceramicsubstrate.Theceramictechnologyusesmetalfilledviastointerconnectadjacent ...,Basedonthestackedshellelements,anewtechniqueisusedtostudythelaminatedthi...